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DLCC 4/8

Package for Assembling of Semiconductor Devices and Integrated Microcircuits DLCC 4/8 (ИДЯУ.301176.016)

Technical Specifications

Value

Ceramics Trademark

ВК-94-1

Resistance  of Current-Carrying Conductors Rcon, Ohm, not more than

0,2

Insulation Resistance Rins, Ohm, not less than

109 at Ucon = 100 В

Inductance of Current-Carrying Conductors Lcon,  nanohenry, not more than

5,0

Capacity of Current-Carrying Elements Ccon, pF, not more than

0,25

Dielectric Permittivity  ε, not more than

10,3 for 10 GHz

Loss-Angle Tangent  tg  δ 10-3, not more than

1,5·103 for  10 GHz

Thermal Linear Expansion Coefficient, (TLEC), ºС-1[at  t = (20 ÷ 200) ºС]

6,0·10-6

Thermal Conductivity, W/m K К

13,4

Operating Temperature Range  ºС

from – 60 to +155

Operating Pressure range, Pa

0,67·10³ ÷ 2,92·105

Overall Dimensions, Length x Width x Height, mm

6,0 х 5,5 х1,8

Access Hole Size, mm

4,2 x 3,2

Access Hole Depth, mm

1,24

Wiring Pad Size, mm

3,4 х 4,2

Wiring Pad Number

4

Pin Pad Number

8

Coating of  Current-Carrying Elements

Au

Hermetic Capping Technique

Bonding or Soldering

Weight incl. cap, g, not more than

0,2

Overall and Mounting Dimensions

Electrical Wiring

Wiring Pad Number

А

B

C

D

E

F

Pin Pad Number

1

2

3

4

7,8

5,6

Other Electrical Wirings

Collar is electrical not wired

Grabber UK8 – 2B-1 for Burn-in or Integrated Microcircuits Testing.

 Number of Contact Elements

8

Insulating Resistance, Ohm, not less than

109

Contact Element Current, A

from 0,1·10-6 to 0,5

Voltage, V

from 0,02 to 100

Number of Operating Cycles

10000

Contact Material

BR.B2

Insulation Material

AG-4V

Operating Temperature Range  °С

from –60 to +155

Storage-ability Time, Years

10