DLCC 3/3

Package for Semiconductor Devices DLCC 3/3, KP KT- 113-1 Defined in the Standard GOST 18472 (ИДЯУ.432252.035)
According to its mounting dimensions this is SOD-23 analog.
Technical Specifications |
Value |
Ceramics Trademark |
ВК-94-2 |
Resistance of Current-Carrying Conductors, Rcon Ohm, not more than |
0,1 |
Insulation Resistance Rins, Ohm, not less than |
109 at Ucon = 100 V |
Inductance of Current-Carrying Elements Lпр, nh, not more than |
3,5 |
Capacity of Current-Carrying Elements Ccon,pF not more than |
0,25 |
Dielectric Permittivity ε, not more than |
10,3 for 10 GHz |
Loss-Angle Tangent tg δ 10-3, not more than |
0,6/1,5 for 1MHz/10GHz |
Thermal Linear Expansion Coefficient (TLEC), ºС-1[at t = (20 ÷ 200) ºС] |
5,7·10-6 |
Thermal Conductivity, W/m K |
26,0 |
Operating Temperature Range ºС |
from – 60 to +155 |
Operating Pressure Range, Pa |
0,67·10³ ÷ 2,92·105 |
Overall Dimensions, Length x Width x Height, mm |
2,7 х 2,35 х 0,8 |
Access Hole Size, mm |
2,15 x 1,45 |
Access Hole Depth, mm |
0,44 |
Wiring Pad Size, mm |
(0,8 х 0,7) (0,65 х 0,5) |
Wiring Pad Number |
3 |
Pin Pad Number |
3 |
Coating of Current-Carrying Elements |
Au |
Hermetic Capping Technique |
Adhesive |
Weight incl. Cap, g, not more than |
0,017 |
Overall and Mounting Dimensions
