Sales Department
+7 8162 765 660
+7 8162 765 665

Production of Metal-Ceramic Packages and Bases

Our Company offers a wide range of metal-ceramic packages and bases for civil and special purposes  and guarantee fail-safe assembly, reliability and long-term operation.  Mass production items and items being developed are manufactured using low temperature co-fired ceramic (LTCC) operating in microwave range as well as  high temperature co-fired ceramic (HTCC).

All products are manufactured using ceramic BK-94-1, BK-94-2, DuPont and others meeting electrical and physical requirements of operating conditions. Current carrying elements are plated by Au, Ag, Ni.   

Metal-ceramic bases and packages are designed to mount chips of electronic items – semiconductor devices and microelectronic integrated circuits SMD (surface mounting) with the following hermetic sealing.

Application

  • Bases for light emitting diodes SMD with one-sided and double-sided metallization
  • Packages for semiconductor devices SMD, vc diodes, LEDs including radio-resistant pin-diodes, diode arrangements, Shottky diodes, limited diodes, voltage-regulator diodes,,high –and super high frequency  transistors, transistor arrangements.
  • Packages and bases for electronic devices SMD, microelectronic integrated circuits with a number of chip-pins from 3 to 256, SAW filters and  SAW resonators (SAW – surface acoustic wave).
  • Purpose-made products: micro-cryogenic devices, gas analyzers, low-noise amplifiers designed meeting special requirements of individual consumers.

Our capabilities

  • Working knowledge of complete production technology of metal-ceramic packages and bases using low temperature co-fired ceramic (LTCC) as well as high temperature co-fired ceramic (HTCC).
  • Project engineering – manufacturing – delivery  need not more than 2 months from the moment of mutual approval of design documentation.
  • Complete testing of operating life, vacuum tightness, bondability, mechanical resistance and so on. 
  • Cycle “Project engineering – manufacturing – delivery” lasts not more than 2 months from the moment of mutual approval of design documentation. Mass production of new products is realized within 3 months after the customer approval procedure.
  • Provision of services  for the following manufacturing processes :
    • Ceramic film casting of BK-94-1 and BK-94-2 ceramics film thickness from 0,1mm to 0,254 mm; preparation and film casting from customer's material.
    • Stencil screen manufacturing:
      • Maximum  perform size has to be 540 x 540 mm;
      • Minimum screen size has to be 0,045 mm;
      • Screen material : stainless steel wire Ø 0,023 mm.
    • Electroplating :
      • Electrochemical  nickel-plating with plating thickness from 1 µm to 100µm;
      • Chemical nickel-plating with plating thickness from 1 µm to 100µm ;
      • Immersional (auto-catalyzed) gold-plating  with plating thickness of 0,15 µm
      • Electrochemical gold-plating  with plating thickness from 1 µm to 30 µm.
    • Soldering of ceramic and metal parts:
      • Maximum part size is 250 x 250 mm.
      • Operating environment: hydrogen (hydrogen purity is 99,99), vacuum – 10-6 – 10-7 torr.
      • Maximum temperature has to be 1600°С. .
    • Laser microprocessing:
      • Work materials are ceramics, silicon, glass etc.;
      • Maximum part size is 100 x 100 mm.
      • Maximum part thickness is 2 mm.
      • Processes executed are scribing (dicing), cutting, piercing and so on.
    • Disc dicing:
      • Work materials are ceramics, silicon, glass etc.;
      • Maximum part size is 120 х 120 mm;
      • Maximum part thickness is 4 mm
      • Processes executed are scribing (dicing), cutting
    • Assembly operations:
      • Bonding by gold wire, by thermal compression or by ultrasonic welding.
      • Hermetic sealing by seam welding.